I am an Electrical Engineering student at the University of Virginia with hands-on experience in cleanroom semiconductor fabrication, metrology, and thermal interface materials. I have worked in Stanford’s NanoHeat Lab on nanoscale heat transfer and liquid-metal TIM testing, and I am currently supporting mixed-signal impedance measurement hardware in UVA’s Swami Lab.
Co-designing mixed-signal hardware for impedance signal acquisition. Supporting FPGA data paths and analog front-end design for high-speed ADC/DAC measurement systems.
Building and validating embedded electronics for motor control, battery systems, and vehicle electrical integration.
Photolithography through etch/deposition workflows with metrology, defect diagnosis, and process repeatability improvements.
Co-designed a mixed-signal FPGA system integrating high-speed DAC/ADC for impedance signal acquisition. Designed an ADA4817 analog front-end with feedback compensation, and supported SPI control and high-speed data path integration.
Developed and tested composite thermal interface materials using silicon pin-fin structures and liquid metal, focusing on thermal performance and measurement reliability for high-power electronics cooling.
Contributed to power distribution wiring and high-current integration work. Supported integration testing and considered thermal constraints during system bring-up.
Executed end-to-end cleanroom process flows including lithography, etch, and deposition with metrology. Identified and mitigated common fabrication defects and improved repeatability.
Co-author: Development of Liquid Metal and Silicon Pin Fin Composite Thermal Interface Materials
U.S. Provisional Patent Application 63/809,052 - Silicon pin-fin liquid metal composite TIMs.
Charlottesville, VA | (540) 295-0157